收藏本站
! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C03E.pdf
May.17,2013
! Caution
Continued from the preceding page.
2. Check the cropping method for the printed circuit board
in advance.
2-1. Printed circuit board cropping shall be carried out by
using a jig or an apparatus to prevent the mechanical
stress that can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be
pushed as close to the cropping jig as possible
[Outline of Jig]
and from the back side of the board in order to
minimize the compressive stress applied to the
capacitor.
Not recommended example: when the board is
pushed at a point far from the cropping jig and
from the front side of board as below, the
capacitor may form a crack caused by the tensile
stress applied.
Recommended
Printed Circuit Board
V-groove
Board Cropping Jig
Not recommended
Printed Circuit Board
Direction of Load
Components
Load Point
Direction of Load
Load Point
(2) Example of a suitable machine
An outline of a printed circuit board cropping
machine is shown as follows. Along the lines with
the V-grooves on the printed circuit board, the top
and bottom blades are aligned to one another
when cropping the board.
The misalignment of the position between top and
Printed Circuit Board
[Outline of Machine]
Components
Top Blade
bottom blades may cause the capacitor to crack.
[Principle of Operation]
Printed Circuit Board
Top Blade
Bottom Blade
V-groove
[Cross-section Diagram]
Printed Circuit Board
V-groove
Recommended
Top Blade
Bottom Blade
Top-bottom Misalignment
Top Blade
Bottom Blade
Not Recommended
Left-right Misalignment
Top Blade
Bottom Blade
Front-rear Misalignment
Top Blade
Bottom Blade
Continued on the following page.
55
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
GCM31A7U2J471JX01D CAP CER 470PF 630V 5% U2J 1206
GCM31C5C1H104JA16L CAP CER 0.1UF 50V 5% NP0 1206
GHF459601ZA6N CAP ARRAY 6CH 600PF 50V 1404
GL2L5LS050D-T1-C DELAY LINE 0.5NS +-50PS 16SOIC
GL6R0KA7B200 INDUCTOR BROADBAND 6UH
GP447 CAP CER 47PF 1KV 10% RADIAL
GRF4.0419.013.C GRF4 APPLIANCE INLET FILTER 15A
GRM022R60J332KE19D CAP CER 3300PF 6.3V X5R 01005
相关代理商/技术参数
GCM188R71E154KA37J 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0.15uF 25Volts X7R 0.1 RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GCM188R71E222KA37D 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0.0022uF 25Volts X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GCM188R71E223KA02D 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0603 0.022uF 25volts X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GCM188R71E223KA02J 制造商:Murata Manufacturing Co Ltd 功能描述:
GCM188R71E223KA37D 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0.022uF 25Volts X7R 0.1 RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GCM188R71E223KA37J 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0.022uF 25Volts X7R 0.1 RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
GCM188R71E224K 制造商:MURATA 制造商全称:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitor 0603 X7R 0.22μF 25V
GCM188R71E224KA55 制造商:MURATA 制造商全称:Murata Manufacturing Co., Ltd. 功能描述:Chip Monolithic Ceramic Capacitors for Automotive